Brand: AMAT Description:Chamber Interface Module Condition: Brand New Certificate: COO TEST REPORT WARRANTY LETTER Warranty: 1 year Inventory Qty:3 Payment Term: T/T Shipping Port: Shenzhen AMAT 0100-35054 is a Chamber Interface Module that monitors the equipment operating status in real time to ensure that the plasma process chamber automatically triggers the safety interlock mechanism under abnormal conditions.
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Manufacture |
AMAT |
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Model Number |
0100-35054 |
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Country Of Origin |
USA |
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HS CODE |
85389000 |
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Dimension |
25*10*2cm |
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Packing Dimension |
27*12*4cm |
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Weight |
0.8kg |
Technical parameters
Interface type: VME bus compatible, supports 16-bit parallel data transmission.
Operating voltage: 24V DC ±5%, maximum current load 2A.
Operating temperature: -10°C to 70°C.
Protection level: IP20.
Signal response time: ≤5ms, ensuring fast triggering of interlock
Functional features
1.Enhanced safety protection:
AMAT 0100-35054 integrates multiple sensor input channels, which can synchronously monitor chamber pressure, gas flow and temperature parameters. Once an over-limit value is detected, the power supply is immediately cut off and the source of danger is isolated to ensure the safety of equipment and operators
2.System compatibility optimization:
0100-35054 is compatible with the control systems of AMAT ENDURA, CENTURA and other series of physical vapor deposition (PVD) and chemical vapor deposition (CVD) equipment, supporting plug-and-play configuration without the need for additional drivers
3.High stability and anti-interference:
AMAT 0100-35054 adopts redundant circuit design and electromagnetic shielding coating, which can maintain zero false alarm of signal transmission in high-voltage RF environment (such as ICP etching), and the failure rate is less than 0.01%.
4.Maintainability and diagnostic functions:
Onboard LED status indicator and diagnostic interface support remote fault code reading. Maintenance personnel can quickly locate problem parts through AMAT's dedicated software (such as Applied Producer®) to shorten downtime
Application scenarios
Plasma etching process:
In the high aspect ratio etching of 3D NAND memory, real-time monitoring of chamber pressure is carried out to prevent arc discharge caused by byproduct accumulation
Metal film deposition:
For copper interconnection processes (such as Endura ALPS PVD), gas leaks are detected during sputtering to avoid film contamination
Chamber cleaning process:
During the maintenance cycle of CVD equipment, automatic start and stop of NF₃ plasma cleaning is triggered to ensure that residues are completely removed
